LY IR Pro is a BGA soldering rework station is a dark BGA work station available in V1, V2, V3 versions. It can rework CSP, QFN, MLF, PGA, CBGA, CCGA, for CSP, QFN, MLF, CBGA, CCGA, CBGA, CCGA, with all green proxy and other chip level μBGA welding repairing. This product is designed mainly for desktop, laptop, switches, Xboxes and other play stations, mother boards and graphic cards and with other BGA chips.
LY IR-PRO SC through inventive outline, viable answer for the standard infrared revamp station warming process because of the moderate warming of the wind stream made the most fantastic imperfections. Disordering process takes in the ballpark of 3 minutes. IR-PRO SC without uniting the PC might be extremely advantageous to work. Free upper and more level warming temperature, autonomous temperature estimation. The contact temperature sensor can catch correct, continuous temperature parameters BGA heat. Temperature control is more agreeable. Welding is finished with a caution capacity to tell the client.
- Computer Interface for reflow / reballing profiles
- Dark IR 400W top heating
- Can reflow / reball chip size up to 65 x 65 (certainly large enough to do both PS3 and 360 chips and all laptop chips)
- Bottom preheated size of 260 x 245 (very good, as the T-8280 is ~ 250 x 260 and works great)
Internalized PCB fixture rail for added PCB support and stability
- Has forced air cooling
- Many upgraded Features, also Hot Air Top attachment soon to be released
- This machine reflows play station 3 BGA`s with ease and much faster than IR 6000
- Independent preheating zones use either middle 2 or all 4 pre heating plates
IR-PRO SC with Rs232 interchanges connector. Correspondence with the workstation, the programming supplied IRSOFT temperature control, machine control might be accomplished. Might be set at passage 8 +8 temperature control temperature bend temperature bend can store 10 gatherings.
It repairs transform without wind stream. It does not influence to the encompassing small components. IR-PRO SC expansive zone of the upper part of the warming can effectively repair an assortment of CPU Block, different shielding walled in areas, sweep of different parts opening. IR-PRO Sc could be planted specifically warmed chip BGA patch ball, the warming methodology of the steel cross section is not disfigured (for immediate warming with steel work to clients).